INTRODUCTION
The TR7900Q SII is built on a 2.5 μm high-resolution platform with 25 MP imaging technology for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution’s effectiveness. The 3D SEMI AOI fully integrates with the loader/unloader module to ease the handling of strips and magazines. The Stop-and-Go 3D AOI can inspect die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 15 μm (0.6 mil) wire diameters.
Features
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 2.5 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*.
• Clean Room Class 1000 – ISO Class 6 (ISO 14644-1)
• 2.5 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*.
• Clean Room Class 1000 – ISO Class 6 (ISO 14644-1)
*Optional Modules
Specification
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 25 Mpix |
| Imaging Resolution | 2.5 µm |
| Lighting | Multi-phase True Color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Height Range | 15 mm |
Motion Table & Control
| X Axis Control | Ball Screw + AC Servo Motor or Linear Motor |
| Y Axis Control | Dual Ball Screw + AC Servo Motor or Dual Linear Motor (Optional) |
| Z Axis Control | Ball Screw + AC Servo Motor (Reducer Optional) |
| X-Y Axis Resolution | 0.1 µm |
Board Handling
| Max. Stack Magazine Qty. | 3 Magazines (based on Magazine width 125 mm) |
| Magazine Dimension |
Width: 50 – 175 mm
Length: 120 – 320 mm
Height: 80 – 150 mm
|
| Strip Dimension |
Width *: 35 – 150 mm
Length: 100 – 285 mm
Thickness: 0.1 – 1.5 mm
* When the strip width is between 35-54 mm, will require a special design. |
| Max. Strip Weight | 0.5 kg |
| Strip Carrier / Fixing | Belt Conveyor |
| Top Clearance | 7 mm |
| Bottom Clearance | 10 mm |
| Edge Clearance | 3 mm |
Inspection Functions
| Die Bonding |
Missing
Orientation Rotation Shift Tilted Chipping Crack Scratch Foreign Material Bond line thickness
Epoxy on Die Epoxy Coverage Epoxy Height |
| Wire Bonding |
Broken
Short Sweep/Sink Missing Sway Collapse Loop Height Sagged Wire Cross Wire Gap Wire Tracing
Ball Bond Diameter Ball Placement Stitch Width Stitch Coverage over Ball Ball-off Pad
Ball touch Pad Distance Clubbed Ball Ball Thickness Lifted Ball Low Landing Bond on Contamination
Foreign Material |
| Bonding Area/Pad |
Copper Protrusion
Crack Chipping Exposed Copper Exposed Nickel Target Material Scratches or Brush Marks
Oxidation Foreign Material |
Dimensions
| WxDxH | 990 x 1495 x 1700 mm (Without Auto Load/Unload Module) 2065 x 1490 x 1700 mm (With Auto Load/Unload Module) Note: not including signal tower, signal tower height 515 mm |
| Weight | 823 kg. With Auto Load/Unload Module: 989.5 kg |
