INTRODUCTION
Designed for the SEMI Back-end, Mini-LED, C4 Bumps ( ~ 100 μm Ø) and 008004 paste inspection applications, the TR7007Q SII-S is a 3.5 μm high-resolution 25 MP imaging technology platform. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. The TR7007Q SII-S is equipped with a wide spectrum light system and coaxial lighting to increase the defect detection rate for multiple industry applications. The 3D SEMI SPI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Applications: Bumps, Flux, Glue, Mini-LED Solder, Solder Paste, Surface
Features
• 3.5 μm High-Resolution 3D SEMI Back-end, Mini-LED and 008004 solder inspection
• Advanced Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• High Precision Inspection for Multiple Applications
• Industry 4.0 Ready Platform
• Ensures clean operation with HEPA Filter*
*Optional
• Advanced Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• High Precision Inspection for Multiple Applications
• Industry 4.0 Ready Platform
• Ensures clean operation with HEPA Filter*
*Optional
Specification
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 25 Mpix |
| Imaging Resolution | 3.5 µm / 6 µm |
| Lighting | Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting |
Imaging Performance
| Max. Imaging Speed | 2.1 FOV/sec |
Motion Table & Control
| X-Y-Z Axis Control | Ballscrew + AC Servo with Motion Controller |
| X-Y-Z Axis Resolution | 0.1 µm |
Board Handling
| Max. PCB Size | TR7007Q SII-S: 450 x 450 mm TR7007Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 460 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max. PCB Weight | 3 kg. Optional: 5kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm. Optional: 4 mm / 5 mm |
| Conveyor | Inline Height: 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
| Applications | Bumps Flux Mini-LED Solder Solder Paste |
| Defects Detected | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement |
Height
Area Volume and Offset |
Dimensions
| WxDxH | TR7007Q SII-S: 1000 x 1480 x @15µm: 1710 mm, @3.5µm / 9.8 µm: 1650 mm TR7007Q SII-S DL: 1000 x 1750 x 1700 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7007Q SII-S: 795 kg TR7007Q SII-S DL: 840 kg |
